A CHECKING METHOD FOR CHECKING BONDING STATUS OF PATTERN ELECTRODES AND A BONDING STRUCTURE OF PATTERN ELECTRODES

摘要

PURPOSE: A method for checking a bonding state of a pattern electrode and a bonding structure of a pattern electrode are provided to supply a bonding state for the entire manufactured pattern electrode bonding structure in real time or anytime. CONSTITUTION: A direct conductive pattern electrode bonding structure is made by bonding tap electrodes with substrate pattern electrodes by an adhesive(510). A planar image of the direct conductive pattern electrode bonding structure is obtained using an inspection system(520). The bonding state of the direct conductive pattern electrode bonding structure is determined from the number of balls for check read from the planar image using the inspection system.