| 摘要 |
Disclosed is a method for producing an electrical device by electrically and mechanically interconnecting two objects for bonding. When an adhesive layer ( 25 ) provided to an LCD ( 11 ) and a layer of a second curing agent ( 28 ) provided to a TCP ( 15 ) are brought into tight contact with each other and thrust in this state to each other under heating, a first curing agent in the adhesive layer ( 25 ) and a second curing agent forming the layer of the second curing agent react with each other so that the thermosetting resin in the adhesive layer is polymerized to bond the LCD ( 11 ) and the TCP ( 15 ) together to produce an electrical device. In case a metal chelate or a metal alcoholate and a silane coupling agent are used as the first and second curing agents, respectively, the silane coupling agent and the metal chelate react with each other to yield cations and, by these cations, the thermosetting resin undergoes cationic polymerization. The adhesive may be cured to bond the LCD ( 11 ) and the TCP ( 15 ) together in a shorter time at a lower temperature than in case the conventional adhesive is used. |
