PURPOSE: A board having layer for preventing humidity is provided to reduce the permeability of vapor and oxide by forming a film preventing humidity through a plasma enhanced chemical vapor deposition. CONSTITUTION: A transparent base material(120) is formed with a polymer. A film preventing humidity is formed on the top side of the transparency base material. The film comprises a silicon organic compounds thin film(142) and a silicon inorganic compound(144). The silicon organic compounds thin film is deposited on the one side of the transparent base material by thickness of 3~10mm through plasma chemical vapor deposition. The silicon inorganic compound is formed on the one side of the silicon organic compounds thin film in order to have the thickness less than 1000nm thorough PECVD(Plasma-Enhanced Chemical Vapor Deposition). The silicon organic compounds thin film and silicon inorganic compound thin film are successively formed.
