| 摘要 |
PURPOSE: A method is provided to remarkably reduce time for supplying EMC powder by supplying a first weight EMC powder into a tray before total weight of the EMC powder is calculated. CONSTITUTION: A first weight epoxy molding compound powder for the molding of a semiconductor chip is supplied to a tray(S100). The volume of the semiconductor chip is measured(S200). A second weight of the epoxy molding compound powder necessary for the molding of the semiconductor chip is calculated from the calculated volume(S300). The second weight epoxy molding compound powder is supplied to the tray(S400).
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