| 摘要 |
Disclosed is an adhesive composition for electronic components, which has excellent adhesion durability, thermal cycle performance and insulation reliability under high temperature conditions over a long time. Specifically disclosed is an adhesive composition for electronic components containing a thermoplastic resin, an epoxy resin, a curing agent and an organopolysiloxane. This adhesive composition for electronic components has a glass transition temperature (Tg) after curing of-10°C to 50°C, and the change in Tg after a 1000-hour heat treatment at 175°C is not more than 15%. |
