| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which includes a base having an external electrode to be electrically connected to the outside and a semiconductor element having a surface electrode made of conductive paste, a means and a process of connecting the surface electrode and the external electrode to each other being simplified while joining reliability is secured; and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor device 10 includes: the base 11 having the external electrode 13 to be electrically connected to the outside; and the semiconductor element 15 having the surface electrode 16 made of the conductive paste, wherein the semiconductor element 15 is mounted on the base 11. The external electrode 13 of the base 11 and the surface electrode 16 of the semiconductor element 15 are electrically connected to each other by wire bonding through a gold wire 17. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
