发明名称 EVAPORATIVE COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an evaporative cooling device capable of suppressing a burnout phenomenon. SOLUTION: The evaporative cooling device 10 having a flow passage 20 where a liquid refrigerant boiled and vaporized by receiving heat is made to flow includes a movable wall 18 movable to vary a cross section S of the flow passage 20. When the amount of gas G generated in the flow passage 20 is large, the movable wall 18 is moved to a direction in which the cross section S of the flow passage 20 is expanded. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010139169(A) 申请公布日期 2010.06.24
申请号 JP20080316258 申请日期 2008.12.11
申请人 TOYOTA MOTOR CORP 发明人 SAITO YOSHIHARU;KUBOTA MASATO;SAKAMOTO HIRONOBU
分类号 F28F13/02;F28F1/02;F28F13/08;H01L23/427;H05K7/20 主分类号 F28F13/02
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