| 摘要 |
<p>PURPOSE: A semiconductor package is provided to protect a semiconductor die from an electromagnetic wave and an external shock by arranging a heat sligger formed with a fixed thickness for covering the lower side of a substrate and the semiconductor die. CONSTITUTION: A plurality of first wiring patterns(113) is formed on the upper side(110a) of a substrate(110). A plurality of second wiring patterns(114) is formed on the lower side of the substrate. A first semiconductor die(120) including a bond pad is adhered on the lower side of the substrate. The first conductive wire(130) electrically connects the bond pad of the first semiconductor die and a bond finger of the substrate. A first encapsulant(140) covers the entire center slot of the substrate, the bond pad of the first semiconductor die, and the first conductive wire. A heat sligger(180) is formed into a fixed thickness to cover the lower side of the substrate and the first semiconductor die.</p> |
