| 摘要 |
PROBLEM TO BE SOLVED: To provide a foreign-matter removal method for executing substrate alignment by utilizing a laser-light irradiation device to remove a foreign matter and a light-receiving device so as to apply proper post-treatment to a substrate. SOLUTION: The foreign-matter removal method is configured as follows. A laser-light irradiation part 34, provided in a foreign-matter removal device so as to remove a foreign matter, irradiates misalignment measurement laser light onto the edge of a rotating wafer W placed on a stage 33. The laser light, remaining laser light other than the laser light blocked by the edge of the wafer W, in the irradiated laser light is received by a power meter 35 so as to detect an output of the laser light. A rotation angle of the rotating wafer W is detected so as to calculate an amount of misalignment of the wafer W on the basis of the detected output data of the laser light and the detected rotation angle data. The misalignment of the wafer W is corrected on the basis of the calculated amount of misalignment. Then, the laser light irradiation part 34 irradiates the cleaning laser light onto the edge of the wafer W and concurrently injects a process gas, which reacts with the foreign matter, to the edge thereof so that the foreign matter adhered to the wafer W is decomposed and removed. COPYRIGHT: (C)2010,JPO&INPIT |
