| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting element reducing contaminants attached to and accumulated on a chip to increase the service life of the light emitting element and to stabilize the operation, which has no need of a tight-sealing structure or, which can be easily tight-sealed without strict control, to provide the chip, and to provide a method of manufacturing the light emitting element. SOLUTION: The light emitting element includes a light absorbing film 5 partially absorbing outgoing light, which is formed on a light-outgoing surface P of a laser chip 1, and is structured not to be short-circuited via the light absorbing film 5 when current is supplied to the laser chip 1. For example, light absorbing films 5a, 5b which are made discontinuous relative to an upper surface U and a lower surface D are formed. COPYRIGHT: (C)2010,JPO&INPIT |
