| 摘要 |
<P>PROBLEM TO BE SOLVED: To greatly reduce processes. Ž<P>SOLUTION: A reducing process of level difference of metal wherein, using a photo resist film whose film thickness is gradually varied by reticle wherein transmissivity of ultraviolet rays is selectively varied, as a mask, a metal layer 14 on an inter-layer insulating film 13 is removed to the middle in the thickness direction in an OB region 3, a wiring and electrode pad forming process wherein, in a peripheral circuit region 4 and a pad part region 5, the metal layer 14 on the inter-layer insulating film 13 is patterned to form the outline of a wiring 14A and an electrode pad 14B, and an electrode pad forming process wherein a surface barrier layer 14a of the electrode pad 14B is removed to expose the surface of the metal layer 14 in the pad part region 5, are executed simultaneously. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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