发明名称 VACUUM PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a technique for easily removing a substrate from an electrostatic attraction device in a short time after the end of transporting the substrate in a vacuum in a state wherein the substrate is attracted to and held on the electrostatic attraction device. Ž<P>SOLUTION: Movement of the substrate is started after a first voltage V<SB>1</SB>is applied to an electrode in the electrostatic attraction device to attract the substrate to the electrostatic attraction device, and the voltage applied to the electrode is changed to a second voltage V<SB>2</SB>to reduce an attractive force during the movement. Therefore, the amount of remaining electric charges between the substrate and the electrostatic attraction device at the time of the end of movement of the substrate is smaller and a residual attractive force is reduced, in comparison with conventional techniques wherein the same voltage is applied to the electrode, whereby the time required for removal of the substrate from the electrostatic attraction device is made shorter than those in conventional techniques. In particular, in the case that remaining electric charges are caused to disappear by applying a voltage having an opposite polarity to the electrode for a short period after the end of the movement, the remaining electric charges may disappear without conventional high voltage application. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010141352(A) 申请公布日期 2010.06.24
申请号 JP20100041425 申请日期 2010.02.26
申请人 ULVAC JAPAN LTD 发明人 FUWA KO;MAEHIRA KEN
分类号 H01L21/677;B65G49/07;H01L21/683;H02N13/00 主分类号 H01L21/677
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