| 发明名称 |
Doping of lead-free solder alloys and structures formed thereby |
| 摘要 |
Methods of forming a microelectronic structure are described. Those methods include doping a lead free solder material with nickel, wherein the nickel comprises up to about 0.2 percent by weight of the solder material, and then applying the solder material to a substrate comprising a copper pad.
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| 申请公布号 |
US2010155115(A1) |
申请公布日期 |
2010.06.24 |
| 申请号 |
US20080317598 |
申请日期 |
2008.12.23 |
| 申请人 |
PANG MENGZHI;GURUMURTHY CHARAN |
发明人 |
PANG MENGZHI;GURUMURTHY CHARAN |
| 分类号 |
H05K1/09;B23K31/02;H05K3/00 |
主分类号 |
H05K1/09 |
| 代理机构 |
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代理人 |
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| 地址 |
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