| 摘要 |
PURPOSE: An encapsulating method of an electronic device is provided to easily encapsulate a photo-electronic device with a simple process, in the excellent encapsulating efficiency. CONSTITUTION: An encapsulating method of an electronic device comprises a step of applying a pressure-sensitive adhesive composition(5) based on a partial crystal phase polyolefin to the electronic device(1) to be encapsulated. The polyolefin has the density of 0.86~0.89 grams per cubic centimeters, and the crystallite melting point of over 90 deg C. The pressure-sensitive adhesive composition is provided in an adhesive tape form. The part for encapsulating process on the pressure-sensitive adhesive composition of the electronic device is heated before, during, or after the encapsulating process. |
