CHIP STRUCTURE, CHIP LAMINATED STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE, AND MEMORY

摘要

PROBLEM TO BE SOLVED: To provide a chip structure avoiding warpage of a chip due to thickness reduction.

SOLUTION: The chip structure 1 includes a chip 3a and a chip 3b which are bonded together back to back. The chip 3a and the chip 3b have planar forms which are mutually mirror-reversed relative to bonded surfaces. Owing to this structure, warping stresses in the chip 3a and the chip 3b are canceled out, thereby, the entire warpage of the chip structure is avoided even with thickness reduction of the chip 3a and the chip 3b.

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