发明名称 Sn PLATING MATERIAL AND METHOD FOR PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an Sn-plating material which can maintain low contact resistance even when used for a long time at high temperature, also, in which an Ag-Sn alloy layer can be easily formed, and which can be produced without requiring a complicated treatment operation, and to provide a method for producing the same. SOLUTION: An Sn layer 3 is formed on the surface of a base material 1 made of Cu or a Cu alloy by an electroplating process, thereafter, the surface of the Sn layer 3 is coated with a mixed solution of alcohol and water comprising the nanoparticles of Ag by a wet type film formation process so as to form an Ag nanoparticle coat layer 9, and next, reflow treatment is performed so as to form an Ag3Sn alloy layer 4 on the Sn layer 3. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010138452(A) 申请公布日期 2010.06.24
申请号 JP20080315949 申请日期 2008.12.11
申请人 MITSUBISHI MATERIALS CORP 发明人 KATO NAOKI;SENBOKUYA KAZUAKI;YAMAZAKI KAZUHIKO
分类号 C25D5/50;C23C28/00;C25D5/10;C25D5/12 主分类号 C25D5/50
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