| 摘要 |
PROBLEM TO BE SOLVED: To enhance the uniformity of the film thickness distribution of a plating film irrespective of the film thickness of the plating film. SOLUTION: An apparatus for manufacturing a semiconductor apparatus includes a substrate holding unit 8, a power supply unit 3, an anode 6, and a plurality of dielectric bodies 13. The substrate holding unit 8 can hold a substrate 20 having a cathode 5. The power supply unit 3 supplies the electric power to a peripheral part of the cathode 5. The anode 6 is provided at the position opposite to the cathode 5. A plurality of dielectric bodies 13 are provided between the cathode 5 and the anode 6. The plurality of dielectric bodies 13 are constituted so that, when the plurality of dielectric bodies 13 are projected on a surface parallel to the surface of the cathode 5, the projected patterns are substantially uniform within a plane, and the projected area is variable. COPYRIGHT: (C)2010,JPO&INPIT |
