| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and method for mounting balls, compatible with small-lot production of a wide variety of products, and further which improves quality and productivity, and to provide an apparatus for manufacturing an electronic component. Ž<P>SOLUTION: The ball mounting device 1 includes an array means 2 having an array mask 21 where array holes 22 through which balls 10 pass are arranged, a ball suction mask 31 where suction holes 32 for sucking arrayed balls 10 are arranged, a ball suction head 3 having a base 35 where the ball suction mask 31 is fitted, an elevation means 4, and a turning means 5 of turning the ball suction head 3 so that the ball suction head 3 in an upward state sucks a ball 10 and the ball suction head 3 in a downward state mounts the ball 10. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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