发明名称 METHOD OF FORMING THIN FILM AND APPARATUS FOR FORMING THIN FILM
摘要 A plurality of targets are disposed in parallel with, and at a given distance to, one another. In case a predetermined thin film is formed by sputtering, the occurrence of non-uniformity in the film thickness distribution and the film quality distribution can be restricted. During the time when electric power is charged to a plurality of targets which are disposed inside a sputtering chamber so as to lie opposite to the process substrate, and are disposed at a predetermined distance from, and in parallel with, one another, thereby forming a predetermined thin film by sputtering, each of the targets is reciprocated at a constant speed in parallel with the process substrate. Also, magnet assemblies that form tunnel-shaped magnetic flux in front of each target are reciprocated at a constant speed in parallel with each of the targets. When each of the targets has reached a turning position of the reciprocating movement, the reciprocating movement of each of the targets is stopped for a predetermined period of time.
申请公布号 US2010155225(A1) 申请公布日期 2010.06.24
申请号 US20070446888 申请日期 2007.10.12
申请人 OISHI YUICHI;KOMATSU TAKASHI;KIYOTA JUNYA;ARAI MAKOTO 发明人 OISHI YUICHI;KOMATSU TAKASHI;KIYOTA JUNYA;ARAI MAKOTO
分类号 C23C14/34 主分类号 C23C14/34
代理机构 代理人
主权项
地址