发明名称 Leistungsmodul mit einem oder mehreren Halbleiter-Leistungsbauelementen
摘要 <p>A power module is basically formed of a circuit block, a resin casing surrounding the circuit block, and circuit terminals. The circuit block has a metal base, an insulative substrate disposed on the metal base, and a plurality of circuit parts mounted on the insulative substrate. The resin casing is connected to a periphery of the metal base. The circuit terminals have terminal frames at least partly molded in the resin casing. At least one of the terminal frames has an insertion hole therein to receive an insert pin of a mold. Thus, one of the terminal frames is held in position in the mold by the insert pin of the mold during molding. The power module has an improved terminal wiring structure which stabilizes the quality and improves the reliability of the integral resin casing incorporated with the terminals inserted to the resin casing by insert-molding.</p>
申请公布号 DE19752408(B4) 申请公布日期 2010.06.24
申请号 DE1997152408 申请日期 1997.11.26
申请人 FUJI ELECTRIC SYSTEMS CO. LTD. 发明人 YAMADA, TOSHIFUSA
分类号 H01L25/07;H01L23/48;H01L25/18;H05K3/34 主分类号 H01L25/07
代理机构 代理人
主权项
地址