EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD

摘要

When a wafer (W) on a fine movement stage (WFS1) supported by a coarse movement stage (WCS1) is exposed via a projection optical system (PL)with an illumination light (IL) at an exposure station (200), a position of the fine movement stage (WFS1) within an XY plane is measured with good precision by a measurement system (70A). Further, when an alignment to a wafer (W) on a fine movement stage (WFS2) supported by a coarse movement stage (WCS2) is performed at a measurement station (300), a position of the fine movement stage (WFS2) within an XY plane is measured with good precision by a measurement system (70B).