SHRINK PACKAGE ON BOARD

摘要

PROBLEM TO BE SOLVED: To provide a package allowing the inspection of the package to be easily carried out when the package is mounted on a board.

SOLUTION: A method of forming a device includes a step of providing a printed circuit board substrate 120 having a die attaching region on a first surface of thereof. The method also includes a step of attaching a die 110 to the die attaching region 128. The die is electrically connected to first land pads 138 disposed around the die attachment region on the first surface. A cap is formed in a target area by a top gate process to produce the cap 184 with an even surface. The cap covers the die and leaves at least the first land pads exposed.

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