HEAT DISSIPATING DEVICE FOR ELECTRONIC APPARATUS, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To reduce the thickness and size of an electronic apparatus while preventing a case of the electronic apparatus from locally having a high temperature. SOLUTION: The heat dissipation device for an electronic apparatus has: the magnesium case 11 (case made of a heat conductive material) capable of dissipating heat in the case; an aluminum sheet metal 32 (heat receiving member) capable of receiving heat from a lamp unit 41 and transferring the received heat; a melamine foam 31 (heat insulating member) configured to prevent transmission of the heat received by the aluminum sheet metal 32; and graphite sheet 21 (heat diffusing member) receiving heat from the melamine foam 31 and diffusing the received heat into the magnesium case 11. COPYRIGHT: (C)2010,JPO&INPIT