| 摘要 |
A semiconductor device includes: the mounting surface of the wiring substrate exposed from the semiconductor element is covered by a solder-resist layer, a part of the solder-resist layer covering the mounting surface of the wiring substrate at a dropping-commencing point at which dropping of a liquid-state under-filling agent filled in a gap between the semiconductor element and the mounting surface of the wiring substrate is commenced is extended in an area of the wiring substrate covered by the semiconductor element, and a gap between the semi conductor element at the dropping-commencing point and the vicinity thereof and an extension portion of the solder-resist layer is formed to be narrower than the gap between the semi conductor element and the mounting surface of the wiring substrate so that liquid drops of the under-filling agent dropped at the dropping-commencing point are sucked into the gap by a capillary phenomenon.
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