发明名称 METHOD OF CUTTING AN ELECTRICAL FUSE
摘要 A semiconductor device includes a semiconductor substrate, and an electrical fuse including a first conductor including a first cutting target region, and a second conductor branched from the first conductor and connected to the first conductor and including a second cutting target region, which are formed on the semiconductor substrate, wherein a flowing-out region is formed of the first conductor flowing toward outside between the first cutting target region and the second cutting target region in a condition of cutting the electrical fuse.
申请公布号 US2010159673(A1) 申请公布日期 2010.06.24
申请号 US20100715625 申请日期 2010.03.02
申请人 NEC ELECTRONICS CORPORATION 发明人 UEDA TAKEHIRO
分类号 H01L21/479 主分类号 H01L21/479
代理机构 代理人
主权项
地址