A thermal module includes a blower, a fin unit and a heat pipe. The blower includes a housing and an impeller received in the housing. The housing defines an air inlet and an air outlet perpendicular to the air inlet. The fin unit is arranged at the air outlet of the blower. The heat pipe includes a tube defining a chamber, and a wick structure disposed in the chamber. The heat pipe forms an evaporation section and a condensation section attaching to the fin unit. At least one contacting member is depressed inwardly from the evaporation section of the heat pipe for accommodating an electronic component therein. A depth of the chamber at the at least one contacting member is less than that at other portion of the evaporation section of the heat pipe without the at least one contacting member.
