A POSITIVE PHOTORESIST COMPOSITION

摘要

PURPOSE: A positive photoresist composition is provided to obtain excellent heat resistance and improved residual film rate and to be used for a process of manufacturing a semiconductor and a liquid crystal display device. CONSTITUTION: A positive photoresist composition comprises; 10 ~ 25 weight% of an alkali-soluble resin; 1 ~ 10 weight% of a dissolution inhibitor; 0.01 ~ 10 weight% of an additive including a diisocyanate compound which is marked as a chemical formula 1; and a solvent. In the chemical formula 1, R is an aromatic compound having a carbon number of 6 ~ 24 and an aliphatic compound having a carbon number of 1 ~ 12. The compound, which is marked as the chemical formula 1, is toluene 2,4-diisocyanate(TDI) which is marked as a chemical formula 2.