| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive polyimide precursor composition which has a small coefficient of thermal expansion, suppresses the deterioration of adhesion to a substrate and the warpage of the substrate, accordingly, and can give a resin film free of the deterioration of electric properties, resolution and the like. <P>SOLUTION: The photosensitive resin composition is mainly composed of a polyimide precursor having a benzoxazole skeleton and a phenolic hydroxyl group, a vinyl ether compound and a photoacid generator, can be developed with an aqueous alkali solution, and has positive pattern forming capability. <P>COPYRIGHT: (C)2010,JPO&INPIT |
