| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition based on a vinyl compound and for use in a printed wiring board for a multilayer board or for high frequency wave, which is excellent in varnish shelf life at low temperature and does not show the decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and to provide a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition. <P>SOLUTION: The resin composition contains a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d). <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
