| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To adequately separate a protective tape without accelerating chipping or cracking greatly even if defects have occurred at an outer periphery of a semiconductor wafer. <P>SOLUTION: An outer periphery of a semiconductor wafer is captured by a CCD camera, an image analysis is performed to the image data, and defects such as chipping or cracking at the outer periphery of the wafer are detected to store the positions of the defects. A spacing between adjacent defects is calculated from the positional information stored. The calculation result is compared with a predetermined width of a separation tape, and a spacing part lager than the separation tape is obtained by calculation process. As a result of the calculation, if a spacing with a width wider than the separation tape is found, the spacing part is determined as a position for sticking the separation tape, and positioning of the wafer is performed. Then, a protective tape is integrally separated from the surface of the wafer by separating the separation tape while sticking the separation tape to the protective tape on the wafer. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
