| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device for applying a predetermined soldering treatment to a printed board. SOLUTION: A board catching means applies a first soldering treatment of sliding a printed board back and forth with respect to a transport direction by a transport mechanism in the state where melted solder is protrusively jetted from the melted solder surface at the height of the melted solder surface, and a second soldering treatment of rocking the printed board by executing a slide operation by the transport mechanism while varying the holding attitude of the printed board by a lift mechanism in the state where the melted solder is not protrusively jetted from the melted solder surface. COPYRIGHT: (C)2010,JPO&INPIT |
