| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which thermal and electric connections between a heat sink and a mounting substrate are improved. <P>SOLUTION: The semiconductor device includes the mounting substrate 10 having a metal portion 11 patterned for heat dissipation and wiring, arrayed on a mounting surface, the heat sink 20 mounted on the mounting substrate 10 and connected to the metal portion 11, and a semiconductor element 30 mounted on the heat sink 20. The heat sink 20 has a plurality of solder mounting areas arranged in an area array on the side of the mounting surface 10A of the mounting substrate 10, and the heat sink 20 and mounting substrate 10 are connected to each other by fusing and connecting a first solder portion 26 arranged in the solder mounting area and a second solder portion 16 arranged at the metal portion 11 to each other. <P>COPYRIGHT: (C)2010,JPO&INPIT |
