| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus in which scattered matter can be recovered without providing an exclusive sucking nozzle for recovering the scattered matter, and to provide a sucking mechanism using the same. <P>SOLUTION: The laser beam machining apparatus includes: a laser beam machining part 5 in which a laser beam L is emitted from the upper part of a substrate W and the laser beam machining is performed to the lower part of the substrate W; the sucking mechanism 6 for sucking and holding the substrate W from the side of the lower part of the substrate W, and an X-axis linear motor 3; and a Y-axis linear motor 4 for positioning the substrate W in a machining position by the laser beam machining part 5 by relatively moving the sucking mechanism 6 and laser beam machining part 5. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
