发明名称 |
Methods of forming low interface resistance rare earth metal contacts and structures formed thereby |
摘要 |
Methods and associated structures of forming a microelectronic device are described. Those methods may include forming a contact opening in an inter layer dielectric (ILD) disposed on a substrate, wherein a source/drain contact area is exposed, forming a rare earth metal layer on the source/drain contact area, forming a transition metal layer on the rare earth metal layer; and annealing the rare earth metal layer and the transition metal layer to form a metal silicide stack structure.
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申请公布号 |
US2010155954(A1) |
申请公布日期 |
2010.06.24 |
申请号 |
US20080317180 |
申请日期 |
2008.12.18 |
申请人 |
MUKHERJEE NILOY;METZ MATT;DEWEY GILBERT;KAVALIEROS JACK;CHAU ROBERT S |
发明人 |
MUKHERJEE NILOY;METZ MATT;DEWEY GILBERT;KAVALIEROS JACK;CHAU ROBERT S. |
分类号 |
H01L23/48;H01L21/4763 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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