发明名称 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 A wiring board has a conductive pattern, an electronic component connected to the conductive pattern by means of a via hole, and a substrate where the electronic component is built into. The connection interface between the via hole and the electronic component inclines toward the connection interface between the via hole and the conductive pattern.
申请公布号 US2010155124(A1) 申请公布日期 2010.06.24
申请号 US20090490409 申请日期 2009.06.24
申请人 IBIDEN CO., LTD. 发明人 KAWAMURA YOICHIRO;SHIMIZU KEISUKE
分类号 H05K1/16;H05K3/30 主分类号 H05K1/16
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