| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component, which is manufactured through a process of dividing an unburnt block into individual blocks after forming the unburnt block, and with which product parts and non-product part are precisely separated after the unburnt block is divided and burnt. Ž<P>SOLUTION: A mother block 1 is divided into a plurality of chips 11, 12 and 13, photosensitive inorganic material paste (photosensitive glass paste) 3 is applied to the principal surface thereof and then exposed and developed to obtain a state where at least some of the chips have the photosensitive inorganic material paste left over two or more chips. In the state, the mother block is burnt and then the chips having been burnt are classified into a first group 1G of individually divided chips and a second group 2G of two or more chips connected by the burnt body of the left photosensitive inorganic material paste. The chips classified into the second group are determined as chips other than chips to be individual electronic component elements. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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