发明名称 HEAT DISSIPATION STRUCTURE FOR ELECTRONIC APPARATUS CASE BODY
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure for an electronic apparatus case body which suppresses the amount of solar radiation reaching the electronic apparatus case body by improving heat dissipation performance in the neighborhood of the top surface of the electronic apparatus case body. Ž<P>SOLUTION: A sunshade member 2 which is formed by combining a plurality of longitudinal plates 2a arrayed in a longitudinal direction with a plurality of horizontal plates 2b arrayed in a horizontal direction to be mutually in a lattice shape is arranged in the neighborhood of the top surface of the electronic apparatus case body 1. Thus, the heat dissipation performance is improved in the neighborhood of the top surface of the electronic apparatus case body, and also the amount of solar radiation reaching the electronic apparatus case body is suppressed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010141022(A) 申请公布日期 2010.06.24
申请号 JP20080314533 申请日期 2008.12.10
申请人 MITSUBISHI ELECTRIC CORP 发明人 HIMURA NAOTO;UCHINO HIDEKI
分类号 H05K7/20 主分类号 H05K7/20
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