| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an organic light-emitting device in which the optical heating temperature in a frit material layer with a thickness by which the electrode layer of the element substrate is not separated is maintained, and the whole of the frit material layer is melted to apply sealing with excellent substrate adhesion and no occurrence of cracks. Ž<P>SOLUTION: The manufacturing method of an organic light-emitting device has a process to form frit material layers 5, 6 on a sealing substrate 9 and a process in which the frit material layers 5, 6 are melted by irradiating laser beams and the element substrate 1 and the sealing substrate 9 are sealed. The process to form the frit material layers 5, 6 is a process in which the plurality of layers of the frit material layers 5, 6 containing a laser beam absorbent are laminated so that the laser beam transmissivity may be reduced in order, and the laser beams are irradiated from the frit material layer 6 side with high laser beam transmissivity. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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