摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a semiconductor testing device capable of reducing cost. Ž<P>SOLUTION: The semiconductor testing device includes, an interface board in which an electric circuit as an interface to external equipments is disposed, a control board in which an electric circuit for controlling the device is disposed, and a backboard to the one face of which each of the interface board and the control board is connected by a connector, wherein the backboard includes plate shaped first and second backboards which are divided into 2 with a gap, and a connecting board connected to the other face of the first and the second backboard with a connector. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|