| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an encapsulating epoxy resin composition that is less liable to warp and is highly reliable in resistance to humidity, an electronic component device including elements encapsulated therewith, and a wafer level chip size package. Ž<P>SOLUTION: The encapsulating epoxy resin composition includes at least a liquid epoxy resin, a curing agent, fine rubber particles, and an inorganic filler, the epoxy resin composition further containing a specific polysiloxane compound. More specifically, the encapsulating epoxy resin composition includes (A) a liquid epoxy resin, (B) an aromatic amine curing agent, (C) a polysiloxane compound having a polyester block structure (terminal: hydroxyl group) on both sides thereof, (D) fine rubber particles, (E) an inorganic filler, (F) a coupling agent, and (G) an organic solvent. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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