发明名称 |
Low cost anufacturing of micro-channel heatsink |
摘要 |
A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar surface. The cooling device also includes a channel layer bonded to an opposite side of the ceramic substrate and a manifold layer bonded to an outer surface of the channel layer. The substrate layers are bonded together using a high temperature process such as brazing to form a single substrate assembly. A plenum housing is bonded to the single substrate assembly via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports.
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申请公布号 |
US2010157526(A1) |
申请公布日期 |
2010.06.24 |
申请号 |
US20080317361 |
申请日期 |
2008.12.22 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
BEAUPRE RICHARD ALFRED;STEVANOVIC LJUBISA DRAGOLJUB;ERNO DANIEL JASON;WOYCHIK CHARLES GERARD |
分类号 |
H05K7/20;B21D53/02 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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