| 摘要 |
PURPOSE: A semiconductor package is provided to be applicable in a fine pitch by electrically connecting a semiconductor die with a substrate through an anisotropic conductive film. CONSTITUTION: A first wiring pattern(113) is formed on the upper side(110a) of a substrate(110). A second wiring pattern(114) is formed on the lower side(110b) of the substrate. The first semiconductor die(120) is adhered on the upper side of the substrate through an anisotropic conductive film(122). A second semiconductor die(150) is adhered on the upper side of the first semiconductor die. A conductive wire(160) electrically connects the second bond pad and the first wiring pattern. An encapsulant(170) encapsulates the substrate, the first semiconductor die, the second semiconductor die, and the conductive wire.
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