| 摘要 |
PROBLEM TO BE SOLVED: To automate work for bonding film covers onto surfaces of various sizes of booklets. SOLUTION: This film cover bonding system includes: a film supplying device 200 for cutting a band-like resin film 10 in response to the size of the bonding-objective booklet, to be supply-arranged to a preset film supply position; a film bonding device 300 for moving the booklet from an opposed position to cross the booklet with respect to the film 10 arranged in the film supply position, and for bonding the film 10 onto the surface of the booklet; a film conveying device 400 for conveying the booklet with the film 10 bonded on the surface; a film partial cutter 500 for cutting circular-arc-shapedly a corner part peripheral portion of the booklet, in the film 10 extended from an end edge of the booklet surface; an end turn-in device 600 for turning the film 10 extended from an end edge of the end of the booklet surface in each of cover reverse face sides of the booklet; and a top and bottom turn-in device 900 for turning the film 10 extended from each end edge of a top and a bottom of the booklet surface in the cover reverse face sides of the booklet. COPYRIGHT: (C)2010,JPO&INPIT |
