| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an Ni-Si-Co base copper alloy which is suitably used for various electronic components, and particularly, has uniform coating properties of plating. <P>SOLUTION: The copper alloy for an electronic material comprises, by mass, 1.0 to 2.5% Ni, 0.5 to 2.5% Co and 0.3 to 1.2% Si, and the balance Cu with inevitable impurities, and in which the average crystal grain size at the center of the sheet thickness is ≤20 μm, and the number of crystal grains in contact with the surface and also with the major axis of ≥45 μm is ≤5 pieces to 1 mm of rolling direction length. The copper alloy may further comprise Cr by 0.5 mass% at the maximum, and may comprise one or more kinds selected from the group consisting of Mg, P, As, Sb, Be, B, Mn, Sn, Ti, Zr, Al, Fe, Zn and Ag by 2.0 mass% at the maximum in total. <P>COPYRIGHT: (C)2010,JPO&INPIT |
