| 摘要 |
<P>PROBLEM TO BE SOLVED: To simplify the manufacturing process of an insert chip and manufacture it at a low cost. <P>SOLUTION: The insert chip includes: a chip substrate 14b which has ring-shaped cooling medium passage spaces w3, w7 opening upwardly and a pipe 14p penetrating upwardly the center of the space on the upper end, a nozzle 15 concentric with the pipe on the lower end, an electrode insertion hole 14Ch extending from the nozzle to the upper end of the pipe, and a pair of cooling medium passage holes 14hR, 14hL facing with each other intervening the electrode insertion hole which have a bottomed lower end and an upper end opening to the cooling medium passage space; and a pair of partition boards 31, 32 which are in parallel with the yz plane (paper face of the figure) having respective central axes of the pair of cooling medium passage holes 14hR, 14hL, have an upper end protruding to the spaces w3, w7 and a lower end located at the position spacing spaces w5R, w5L for the cooling medium passage from the hole bottoms of the passage holes 14hR, 14hL, and divide in two the passage holes 14hR, 14hL by the plane. <P>COPYRIGHT: (C)2010,JPO&INPIT |
