| 摘要 |
PROBLEM TO BE SOLVED: To suppress fracture of a joint of a bump electrode of a semiconductor chip and a bonding lead of a wiring board. SOLUTION: A matrix substrate (wiring board) 11 where a plurality of projection electrodes of the semiconductor chip 1 are electrically connected to bonding leads is conveyed to an underfill resin charging stage (second stage) having been heated by using a conveyance device TR including a substrate holding portion TRa for picking up and holding the matrix substrate 11, a support portion Trb for supporting the substrate holding portion Tra, a conveyance portion Trc for conveying the matrix substrate 11 together with the support portion Trb, and a heater (substrate heating portion) Trd for heating the matrix substrate 11. COPYRIGHT: (C)2010,JPO&INPIT |
