| 摘要 |
PROBLEM TO BE SOLVED: To provide a polymerization method for a polymer for forming an insulating film, capable of suppressing gelation so as to yield stable quality, a useful material for an organic insulating film having a low dielectric constant, high heat resistance and high mechanical strength, an organic insulating film having a low dielectric constant, high heat resistance and high mechanical strength, and an electronic device having the organic insulating film. SOLUTION: The polymerization method for the polymer for forming the insulating film comprises polymerizing a group containing a polymerizable unsaturated bond with a cage-type compound having a cage structure comprising an adamantane structure as a minimum unit through a multistage reaction comprising at least two steps. In each reaction step, polymerization is carried out at a reaction temperature at least 1°C lower than that in the previous reaction step. The material for an organic insulating film contains the polymer for forming an insulating film obtained by carrying out polymerization through the polymerization method. The organic insulating film is obtained by subjecting the material for an organic insulating film to a crosslinking reaction by heating, activation energy ray irradiation or a combination thereof. The electronic device is equipped with the organic insulating film. COPYRIGHT: (C)2010,JPO&INPIT |
