MAGNETRON SPUTTERING APPARATUS, AND MAGNETRON SPUTTERING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a magnetron sputtering apparatus, and a magnetron sputtering method by which the distribution of film thickness can easily be controlled by using a blocking body. SOLUTION: The magnetron sputtering apparatus comprises: a substrate holding unit 11; a magnet 13 which is rotatably provided facing an opposing surface of a sputtered surface 12a of a plate-like target 12 provided facing the substrate holding unit 11, generates the electron orbit 20 having a center C2 at the position offset with respect to the center C1 of rotation in a vicinity of the sputtered surface 12a; and the blocking body 14 which is provided between a target 12 and a substrate 10 and rotated synchronously with the magnet 13 without changing the relative position to the electron orbit 20 while blocking a part of the electron orbit 20 in plan view of the target 12 from the substrate 10 side. COPYRIGHT: (C)2010,JPO&INPIT