| 摘要 |
<p>PURPOSE: A die bonder and a die bonding method using the same are provided to reduce the time required to perform die bonding work by immediately separating and a eliminating a film from a wafer. CONSTITUTION: A fixing unit(100) adsorbs and fixes a wafer. A film eliminating unit(300) eliminates film from the wafer. A substrate supplier(400) supplies a substrate. An adhesive coating unit(500) coats an adhesive on a die or the substrate. A bonding unit(600) bonds the die on a fixed location of the substrate.</p> |
