| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible multilayer wiring board which includes a cable portion with superior elasticity and is adaptive to thin high-density component mounting, and a method of manufacturing the same. SOLUTION: The flexible multilayer wiring board includes a mounting portion and a cable portion formed using inner-layer wiring bodies 111, 121, 131 having a conductive pattern 6 formed on at least one surface of an insulating base material 5, wherein the mounting portion is formed such that a composite layer 4 of a rigid material and an adhesive resin covers the conductive pattern 1, and the cable portion includes an adhesive layer 3 formed containing no rigid material and also includes a surface, which comes into contact with neither the composite layer nor the conductive pattern of the adhesive layer, covered with one continuous insulating film 2; and the method of manufacturing the same. COPYRIGHT: (C)2010,JPO&INPIT |
